7005S55J
vs
7005S55JG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
PLCC
Package Description
0.950 X 0.950 INCH, 0.120 INCH HEIGHT, PLASTIC, LCC-68
QCCJ,
Pin Count
68
Manufacturer Package Code
PL68
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
55 ns
Additional Feature
INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE
I/O Type
COMMON
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
JESD-609 Code
e0
Length
24.2062 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
MULTI-PORT SRAM
DUAL-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
2
Number of Terminals
68
68
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX8
8KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Seated Height-Max
4.572 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.25 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
30
Width
24.2062 mm
Base Number Matches
1
1
Compare 7005S55J with alternatives
Compare 7005S55JG8 with alternatives