7005S35PFG8 vs 7005L35PFB feature comparison

7005S35PFG8 Integrated Device Technology Inc

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7005L35PFB Integrated Device Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP
Package Description TQFP-64 QFP, QFP64,.66SQ,32
Pin Count 64
Manufacturer Package Code PNG64
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Date Of Intro 1992-01-01
Access Time-Max 35 ns 35 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Memory Density 65536 bit 65536 bit
Memory IC Type MULTI-PORT SRAM APPLICATION SPECIFIC SRAM
Memory Width 8 8
Moisture Sensitivity Level 3 3
Number of Functions 1
Number of Terminals 64 64
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Base Number Matches 2 1
I/O Type COMMON
Number of Ports 2
Output Characteristics 3-STATE
Package Equivalence Code QFP64,.66SQ,32
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Standby Current-Max 0.004 A
Standby Voltage-Min 2 V
Supply Current-Max 0.25 mA
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) 30

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