7005L35JB
vs
IDT70V05L35JI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QCCJ, LDCC68,1.0SQ
QCCJ, LDCC68,1.0SQ
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
APPLICATION SPECIFIC SRAM
MULTI-PORT SRAM
Memory Width
8
8
Moisture Sensitivity Level
1
1
Number of Ports
2
2
Number of Terminals
68
68
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC68,1.0SQ
LDCC68,1.0SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
225
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.004 A
0.005 A
Standby Voltage-Min
2 V
3 V
Supply Current-Max
0.25 mA
0.17 mA
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
20
Base Number Matches
1
1
Part Package Code
LCC
Pin Count
68
Length
24.2062 mm
Number of Functions
1
Seated Height-Max
4.57 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Width
24.2062 mm
Compare 7005L35JB with alternatives
Compare IDT70V05L35JI with alternatives