7005L25PFGB8
vs
70V05S25PFG8
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
QFP,
|
14 X 14 MM, 1.40 MM HEIGHT, GREEN, TQFP-64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
25 ns
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
DUAL-PORT SRAM
|
DUAL-PORT SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
64
|
Number of Words |
8192 words
|
8192 words
|
Number of Words Code |
8000
|
8000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
8KX8
|
8KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
LQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
|
Length |
|
14 mm
|
Seated Height-Max |
|
1.6 mm
|
Terminal Pitch |
|
0.8 mm
|
Width |
|
14 mm
|
|
|
|
Compare 7005L25PFGB8 with alternatives
Compare 70V05S25PFG8 with alternatives