7005L20JGI
vs
7005L20GG8
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
PLCC
|
|
| Package Description |
0.950 X 0.950 INCH, 0.120 INCH HEIGHT, GREEN, PLASTIC, LCC-68
|
PGA,
|
| Pin Count |
68
|
|
| Manufacturer Package Code |
PLG68
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Date Of Intro |
1992-01-01
|
|
| Access Time-Max |
20 ns
|
20 ns
|
| JESD-30 Code |
S-PQCC-J68
|
S-CPGA-P68
|
| JESD-609 Code |
e3
|
|
| Memory Density |
65536 bit
|
65536 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
DUAL-PORT SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
PGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
J BEND
|
PIN/PEG
|
| Terminal Position |
QUAD
|
PERPENDICULAR
|
| Base Number Matches |
3
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare 7005L20JGI with alternatives
Compare 7005L20GG8 with alternatives