68681/BQA vs 935263294557 feature comparison

68681/BQA YAGEO Corporation

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935263294557 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description DIP-40 QFP,
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 4
Boundary Scan NO NO
Clock Frequency-Max 4 MHz 8 MHz
Communication Protocol ASYNC, BIT; BISYNC ASYNC, BIT
Data Encoding/Decoding Method NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL (MANCHESTER)
Data Transfer Rate-Max 0.125 MBps 1 MBps
External Data Bus Width 8 8
JESD-30 Code R-CDIP-T40 S-PQFP-G44
Low Power Mode NO NO
Number of Serial I/Os 2 2
Number of Terminals 40 44
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.25 V 3.63 V
Supply Voltage-Min 4.75 V 2.97 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount NO YES
Technology MOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL QUAD
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code QFP
Pin Count 44
Additional Feature ALSO OPERATES AT 5V SUPPLY
Bus Compatibility 68XXX; 80XXX
Length 10 mm
Moisture Sensitivity Level 3
Package Code QFP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 2.1 mm
Terminal Finish Pure Tin (Sn)
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10 mm

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Compare 935263294557 with alternatives