68681/BQA vs XR-68C681CP feature comparison

68681/BQA NXP Semiconductors

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XR-68C681CP Exar Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS EXAR CORP
Part Package Code DIP DIP
Package Description CERAMIC, DIP-40 DIP,
Pin Count 40 40
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01
Address Bus Width 4
Boundary Scan NO NO
Bus Compatibility 6800 MC68681; SCC68692
Clock Frequency-Max 4 MHz 4 MHz
Communication Protocol ASYNC, BIT; BISYNC ASYNC, BIT
Data Encoding/Decoding Method NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL (MANCHESTER) NRZ
Data Transfer Rate-Max 0.125 MBps 0.125 MBps
External Data Bus Width 8 8
JESD-30 Code R-GDIP-T40 R-PDIP-T40
Low Power Mode NO NO
Number of DMA Channels
Number of I/O Lines 14 14
Number of Serial I/Os 2 2
Number of Terminals 40 40
On Chip Data RAM Width
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (words) 0 0
Seated Height-Max 5.715 mm 6.35 mm
Supply Current-Max 150 mA 10 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology MOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Length 51.75 mm
Moisture Sensitivity Level NOT APPLICABLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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