63S881NS
vs
DM87S281AJ
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MONOLITHIC MEMORIES
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP-24
DIP, DIP24,.3
Reach Compliance Code
unknown
unknown
Access Time-Max
20 ns
45 ns
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Memory Density
8192 bit
8192 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1KX8
1KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
BIPOLAR
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
ECCN Code
EAR99
HTS Code
8542.32.00.71
Output Characteristics
3-STATE
Seated Height-Max
5.715 mm
Supply Current-Max
0.17 mA
Width
7.62 mm
Compare 63S881NS with alternatives
Compare DM87S281AJ with alternatives