63S881N vs MB7132HM feature comparison

63S881N AMD

Buy Now Datasheet

MB7132HM FUJITSU Limited

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU LTD
Part Package Code DIP DIP
Package Description DIP, DIP24,.6 DIP, DIP24,.6
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
kg CO2e/kg 12 12
Average Weight (mg) 5781.95 5781.95
CO2e (mg) 69383.402 69383.402
Category CO2 Kg 12 12
Compliance Temperature Grade Commercial Extended: +0C to +75C Commercial: +0C to +70C
Access Time-Max 120 ns 65 ns
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Length 32.004 mm
Memory Density 1048576 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 4
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 1024 words 1024 words
Number of Words Code 128000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min
Organization 128KX8 4KX4
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.6 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 0.16 mA 0.17 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 2

Compare 63S881N with alternatives