6341-1L
vs
CY7C225-30DMB
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MONOLITHIC MEMORIES
|
CYPRESS SEMICONDUCTOR CORP
|
Reach Compliance Code |
unknown
|
not_compliant
|
Access Time-Max |
55 ns
|
20 ns
|
JESD-30 Code |
S-MQCC-N28
|
R-GDIP-T24
|
Memory Density |
32768 bit
|
4096 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
24
|
Number of Words |
512 words
|
512 words
|
Number of Words Code |
4000
|
512
|
Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
75 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
4KX8
|
512X8
|
Package Body Material |
METAL
|
CERAMIC, GLASS-SEALED
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
0.175 mA
|
0.12 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Position |
QUAD
|
DUAL
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
DIP
|
Package Description |
|
DIP, DIP24,.3
|
Pin Count |
|
24
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.71
|
Additional Feature |
|
BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS
|
I/O Type |
|
COMMON
|
JESD-609 Code |
|
e0
|
Output Characteristics |
|
3-STATE
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP24,.3
|
Programming Voltage |
|
13.5 V
|
Screening Level |
|
38535Q/M;38534H;883B
|
Standby Current-Max |
|
0.12 A
|
Supply Voltage-Max (Vsup) |
|
5.5 V
|
Supply Voltage-Min (Vsup) |
|
4.5 V
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare 6341-1L with alternatives
Compare CY7C225-30DMB with alternatives