5SGXMABN3F45C3 vs 5SGXMABN3F45I3N feature comparison

5SGXMABN3F45C3 Intel Corporation

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5SGXMABN3F45I3N Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1932 S-PBGA-B1932
Length 45 mm 45 mm
Number of Inputs 840 840
Number of Logic Cells 952000 952000
Number of Outputs 840 840
Number of Terminals 1932 1932
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 35920 CLBS 35920 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1932,44X44,40 BGA1932,44X44,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.9 mm
Supply Voltage-Max 0.88 V 0.88 V
Supply Voltage-Min 0.82 V 0.82 V
Supply Voltage-Nom 0.85 V 0.85 V
Surface Mount YES YES
Technology TSMC CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 45 mm 45 mm
Base Number Matches 3 1
Package Description FBGA-1932
Number of CLBs 35920
Peak Reflow Temperature (Cel) NOT SPECIFIED
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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