5SGXMABN2F45I2G
vs
5SGXMABN2F45I2LN
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
,
|
FBGA-1932
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Intel
|
| JESD-30 Code |
|
S-PBGA-B1932
|
| JESD-609 Code |
|
e1
|
| Length |
|
45 mm
|
| Moisture Sensitivity Level |
|
4
|
| Number of CLBs |
|
35920
|
| Number of Inputs |
|
840
|
| Number of Logic Cells |
|
952000
|
| Number of Outputs |
|
840
|
| Number of Terminals |
|
1932
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
35920 CLBS
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA1932,44X44,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
3.9 mm
|
| Supply Voltage-Max |
|
0.88 V
|
| Supply Voltage-Min |
|
0.82 V
|
| Supply Voltage-Nom |
|
0.85 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
45 mm
|
|
|
|
Compare 5SGXMABN2F45I2G with alternatives
Compare 5SGXMABN2F45I2LN with alternatives