5SGXEB5R3F43C3N
vs
5SGXEB5R3F43C3G
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
FBGA-1760
|
,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.7.B
|
3A001.A.7.B
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B1760
|
S-PBGA-B1760
|
| Length |
42.5 mm
|
42.5 mm
|
| Number of CLBs |
18500
|
18500
|
| Number of Inputs |
600
|
600
|
| Number of Logic Cells |
490000
|
490000
|
| Number of Outputs |
600
|
600
|
| Number of Terminals |
1760
|
1760
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
18500 CLBS
|
18500 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1760,42X42,40
|
BGA1760,42X42,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Voltage-Max |
0.88 V
|
0.88 V
|
| Supply Voltage-Min |
0.82 V
|
0.82 V
|
| Supply Voltage-Nom |
0.85 V
|
0.85 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TSMC
|
| Temperature Grade |
OTHER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
42.5 mm
|
42.5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5SGXEB5R3F43C3N with alternatives
Compare 5SGXEB5R3F43C3G with alternatives