5SGXEA7H3F35I3N
vs
5SGXEA7H3F35C3G
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
Package Description |
FBGA-1152
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B1152
|
|
Length |
35 mm
|
|
Number of CLBs |
23472
|
|
Number of Inputs |
552
|
|
Number of Logic Cells |
622000
|
|
Number of Outputs |
552
|
|
Number of Terminals |
1152
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
23472 CLBS
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA1152,34X34,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
3.6 mm
|
|
Supply Voltage-Max |
0.88 V
|
|
Supply Voltage-Min |
0.82 V
|
|
Supply Voltage-Nom |
0.85 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
35 mm
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare 5SGXEA7H3F35I3N with alternatives
Compare 5SGXEA7H3F35C3G with alternatives