5SGSMD6N2F45I3LN
vs
5SGSMD6N2F45I3G
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
Package Description |
FBGA-1932
|
,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B1932
|
|
Length |
45 mm
|
|
Number of CLBs |
22000
|
|
Number of Inputs |
840
|
|
Number of Logic Cells |
583000
|
|
Number of Outputs |
840
|
|
Number of Terminals |
1932
|
|
Operating Temperature-Max |
100 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
22000 CLBS
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA1932,44X44,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
3.9 mm
|
|
Supply Voltage-Max |
0.88 V
|
|
Supply Voltage-Min |
0.82 V
|
|
Supply Voltage-Nom |
0.85 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
45 mm
|
|
Base Number Matches |
2
|
1
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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