5M2210ZF324C4N
vs
5M2210ZF324C4
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
Package Description |
19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324
|
LBGA, BGA324,18X18,40
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Intel
|
|
Additional Feature |
YES
|
YES
|
Clock Frequency-Max |
247.5 MHz
|
247.5 MHz
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
JESD-609 Code |
e1
|
e0
|
JTAG BST |
YES
|
YES
|
Length |
19 mm
|
19 mm
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
271
|
271
|
Number of Inputs |
271
|
|
Number of Macro Cells |
1700
|
1700
|
Number of Outputs |
271
|
|
Number of Terminals |
324
|
324
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
271 I/O
|
271 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
Propagation Delay |
9.1 ns
|
9.1 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.55 mm
|
1.55 mm
|
Supply Voltage-Max |
1.89 V
|
1.89 V
|
Supply Voltage-Min |
1.71 V
|
1.71 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
19 mm
|
19 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
324
|
|
|
|
Compare 5M2210ZF324C4N with alternatives
Compare 5M2210ZF324C4 with alternatives