5CEBA7F27I7
vs
5CGTFD7D5F27C8N
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Package Description |
FBGA-672
|
ROHS COMPLIANT, FBGA-672
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B672
|
S-PBGA-B672
|
| Length |
27 mm
|
27 mm
|
| Number of Terminals |
672
|
672
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
2 mm
|
2 mm
|
| Supply Voltage-Max |
1.13 V
|
1.13 V
|
| Supply Voltage-Min |
1.07 V
|
1.07 V
|
| Supply Voltage-Nom |
1.1 V
|
1.1 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Number of Inputs |
|
336
|
| Number of Logic Cells |
|
149500
|
| Number of Outputs |
|
336
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
BGA672,26X26,40
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
OTHER
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 5CEBA7F27I7 with alternatives
Compare 5CGTFD7D5F27C8N with alternatives