5AGXMB1G4F35I5G
vs
5AGXMB1G4F35I5P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
FBGA-1152
FBGA-1152
Reach Compliance Code
compliant
compliant
ECCN Code
3A991
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2019-04-18
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
Length
35 mm
35 mm
Number of CLBs
136880
11321
Number of Inputs
704
704
Number of Logic Cells
300000
300000
Number of Outputs
704
704
Number of Terminals
1152
1152
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
136880 CLBS
11321 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
HBGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
2.7 mm
2.7 mm
Supply Voltage-Max
1.13 V
1.13 V
Supply Voltage-Min
1.07 V
1.07 V
Supply Voltage-Nom
1.1 V
1.1 V
Surface Mount
YES
YES
Technology
TSMC
TSMC
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
35 mm
35 mm
Base Number Matches
1
1
Compare 5AGXMB1G4F35I5G with alternatives
Compare 5AGXMB1G4F35I5P with alternatives