5AGXMB1G4F35C5N
vs
5AGXMB1G4F35C5G
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEL CORP
INTEL CORP
Package Description
FBGA-1152
FBGA-1152
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B1152
S-PBGA-B1152
JESD-609 Code
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
3
Number of CLBs
11321
11321
Number of Inputs
704
704
Number of Logic Cells
300000
300000
Number of Outputs
704
704
Number of Terminals
1152
1152
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
11321 CLBS
11321 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HBGA
HBGA
Package Equivalence Code
BGA1152,34X34,40
BGA1152,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, HEAT SINK/SLUG
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.7 mm
2.7 mm
Supply Voltage-Max
1.13 V
1.13 V
Supply Voltage-Min
1.07 V
1.07 V
Supply Voltage-Nom
1.1 V
1.1 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
35 mm
35 mm
Base Number Matches
1
1
Technology
TSMC
Compare 5AGXMB1G4F35C5N with alternatives
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