5AGXMB1G4F35C5N vs 5AGXMB1G4F35C5G feature comparison

5AGXMB1G4F35C5N Intel Corporation

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5AGXMB1G4F35C5G Intel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-1152 FBGA-1152
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B1152 S-PBGA-B1152
JESD-609 Code e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3
Number of CLBs 11321 11321
Number of Inputs 704 704
Number of Logic Cells 300000 300000
Number of Outputs 704 704
Number of Terminals 1152 1152
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 11321 CLBS 11321 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA1152,34X34,40 BGA1152,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.7 mm 2.7 mm
Supply Voltage-Max 1.13 V 1.13 V
Supply Voltage-Min 1.07 V 1.07 V
Supply Voltage-Nom 1.1 V 1.1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 35 mm
Base Number Matches 1 1
Technology TSMC

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Compare 5AGXMB1G4F35C5G with alternatives