5AGXBA1D4F31I5N vs 5AGXBA1D4F31C5P feature comparison

5AGXBA1D4F31I5N Intel Corporation

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5AGXBA1D4F31C5P Intel Corporation

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description FBGA-896 FBGA-896
Reach Compliance Code compliant compliant
ECCN Code 3A991
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B896 S-PBGA-B896
JESD-609 Code e1
Length 31 mm 31 mm
Moisture Sensitivity Level 3
Number of CLBs 2830 2830
Number of Inputs 416 416
Number of Logic Cells 75000 75000
Number of Outputs 416 416
Number of Terminals 896 896
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2830 CLBS 2830 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA HBGA
Package Equivalence Code BGA896,30X30,40 BGA896,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.7 mm 2.7 mm
Supply Voltage-Max 1.13 V 1.13 V
Supply Voltage-Min 1.07 V 1.07 V
Supply Voltage-Nom 1.1 V 1.1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 1 1
Technology TSMC

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