5962R9666701VXC
vs
HEF4539BP
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
NXP SEMICONDUCTORS
|
Part Package Code |
DFP
|
DIP
|
Package Description |
DFP, FL16,.3
|
DIP, DIP16,.3
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-CDFP-F16
|
R-PDIP-T16
|
JESD-609 Code |
e4
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.00064 A
|
0.00035999999999999997 A
|
Number of Functions |
1
|
2
|
Number of Inputs |
8
|
4
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DFP
|
DIP
|
Package Equivalence Code |
FL16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Prop. Delay@Nom-Sup |
540 ns
|
245 ns
|
Propagation Delay (tpd) |
540 ns
|
240 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class V
|
|
Seated Height-Max |
2.92 mm
|
4.7 mm
|
Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
GOLD
|
|
Terminal Form |
FLAT
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Total Dose |
100k Rad(Si) V
|
|
Width |
6.73 mm
|
7.62 mm
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
No
|
Length |
|
21.6 mm
|
|
|
|
Compare 5962R9666701VXC with alternatives
Compare HEF4539BP with alternatives