5962R9664602VCC vs HEF4030BDB feature comparison

5962R9664602VCC Intersil Corporation

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HEF4030BDB NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T14 R-GDIP-T14
JESD-609 Code e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type XOR GATE XOR GATE
Max I(ol) 0.00064 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 378 ns
Propagation Delay (tpd) 378 ns 175 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Screening Level MIL-PRF-38535 Class V
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Base Number Matches 2 1
Seated Height-Max 5.08 mm
Width 7.62 mm

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Compare HEF4030BDB with alternatives