5962R9663601VEC vs MC14049UBCLD feature comparison

5962R9663601VEC Intersil Corporation

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MC14049UBCLD Freescale Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTERSIL CORP MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Additional Feature RADIATION HARDENED; WITH EXTENDED INPUT VOLTAGE; IOL = 2.4MA @ VOL = 0.4V; IOH = 1.55MA @ VOH = 2.5V CMOS-TTL LEVEL TRANSLATOR
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T16 R-XDIP-T16
JESD-609 Code e4 e0
Length 19.05 mm 19.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER INVERTER
Max I(ol) 0.0033 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 162 ns
Propagation Delay (tpd) 162 ns 60 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Screening Level MIL-PRF-38535 Class V
Seated Height-Max 5.08 mm 4.19 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish GOLD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Width 7.62 mm 7.62 mm
Base Number Matches 3 3
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 4.5/15 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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