5962R9662301VEC vs HEF4014BPN feature comparison

5962R9662301VEC Intersil Corporation

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HEF4014BPN NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction RIGHT RIGHT
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-CDIP-T16 R-PDIP-T16
JESD-609 Code e4
Length 19.05 mm 21.6 mm
Logic IC Type PARALLEL IN SERIAL OUT PARALLEL IN SERIAL OUT
Max Frequency@Nom-Sup 2220000 Hz
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 432 ns 260 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class V
Seated Height-Max 5.08 mm 4.7 mm
Supply Voltage-Max (Vsup) 18 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 8.5 MHz 6 MHz
Base Number Matches 2 2
Rohs Code Yes
Additional Feature OUTPUTS ALSO AVAILABLE AT 6TH AND 7TH STAGE OF THE SHIFT REGISTER
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 40

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Compare HEF4014BPN with alternatives