5962R9661602VEC
vs
HEF4502BDB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP16,.3
DIP,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-CDIP-T16
R-GDIP-T16
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.0038399999999999997 A
Number of Bits
6
6
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
513 ns
Propagation Delay (tpd)
513 ns
170 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
Base Number Matches
2
1
Additional Feature
WITH COMMON INHIBIT FOR ALL BITS
Seated Height-Max
5.08 mm
Width
7.62 mm
Compare 5962R9661602VEC with alternatives
Compare HEF4502BDB with alternatives