5962R9661501VEC
vs
M38510R17601BEX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH; RADIATION HARDENED
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-CDIP-T16
R-GDIP-T16
JESD-609 Code
e4
Load Capacitance (CL)
50 pF
Logic IC Type
D LATCH
D FLIP-FLOP
Number of Bits
1
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
540 ns
560 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
18 V
15 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
10 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
100k Rad(Si) V
Trigger Type
LOW LEVEL
NEGATIVE EDGE
Width
7.62 mm
Base Number Matches
3
3
Output Characteristics
3-STATE
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