5962R9661001VCC
vs
MC14068BCL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
RADIATION HARDENED
Family
4000/14000/40000
JESD-30 Code
R-CDIP-T14
R-XDIP-T14
JESD-609 Code
e4
e0
Length
19.43 mm
Load Capacitance (CL)
50 pF
Logic IC Type
AND/NAND GATE
NAND GATE
Max I(ol)
0.00064 A
Number of Functions
1
Number of Inputs
8
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
405 ns
350 ns
Propagation Delay (tpd)
405 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Screening Level
MIL-PRF-38535 Class V
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
GOLD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
Width
7.62 mm
Base Number Matches
2
4
Rohs Code
Power Supplies
5/15 V
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