5962R9659901V9A
vs
MC10H302P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA INC
Package Description
DIE,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
10H
JESD-30 Code
R-XUUC-N14
R-PDIP-T16
JESD-609 Code
e0
Logic IC Type
PARITY GENERATOR/CHECKER
PARITY GENERATOR/CHECKER
Number of Bits
9
6
Number of Functions
1
2
Number of Terminals
14
16
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Output Polarity
COMPLEMENTARY
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Power Supply Current-Max (ICC)
1 mA
Propagation Delay (tpd)
945 ns
2.5 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
18 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
NO
Technology
CMOS
ECL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Total Dose
100k Rad(Si) V
Base Number Matches
1
3
Length
19.175 mm
Output Characteristics
OPEN-EMITTER
Seated Height-Max
4.44 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962R9659901V9A with alternatives
Compare MC10H302P with alternatives