5962R9657801QXC
vs
5962H9657801QXC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP,
|
DFP, FL20,.3
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AC
|
|
| JESD-30 Code |
R-CDFP-F20
|
R-XDFP-F20
|
| JESD-609 Code |
e4
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
8
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL20,.3
|
FL20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Propagation Delay (tpd) |
19 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class Q
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
2.921 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
100k Rad(Si) V
|
1M Rad(Si) V
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
6.9215 mm
|
|
| fmax-Min |
63 MHz
|
|
| Base Number Matches |
1
|
3
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.008 A
|
| Prop. Delay@Nom-Sup |
|
19 ns
|
|
|
|
Compare 5962R9657801QXC with alternatives