5962R9655501QEX vs 5962-9172301MEA feature comparison

5962R9655501QEX Cobham Semiconductor Solutions

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5962-9172301MEA QP Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer AEROFLEX COLORADO SPRINGS QP SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature TCO OUTPUT TCO OUTPUT
Count Direction UP UP
Family ACT ACT
JESD-30 Code R-CDIP-T16 R-GDIP-T16
Length 19.05 mm
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 24 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 77 MHz 95 MHz
Base Number Matches 1 3
JESD-609 Code e0
Screening Level MIL-STD-883
Terminal Finish TIN LEAD

Compare 5962R9655501QEX with alternatives

Compare 5962-9172301MEA with alternatives