5962R9652601VCC vs 5962-3830202BDX feature comparison

5962R9652601VCC Cobham Semiconductor Solutions

Buy Now Datasheet

5962-3830202BDX Motorola Mobility LLC

Buy Now
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AEROFLEX COLORADO SPRINGS MOTOROLA INC
Part Package Code DIP DFP
Package Description DIP, DFP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AC LS
JESD-30 Code R-CDIP-T14 R-GDFP-F14
JESD-609 Code e4
Length 19.43 mm
Logic IC Type NAND GATE NAND GATE
Number of Functions 2 4
Number of Inputs 4 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Propagation Delay (tpd) 15 ns 30 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class V
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS TTL
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Total Dose 100k Rad(Si) V
Width 7.62 mm
Base Number Matches 1 1

Compare 5962R9652601VCC with alternatives

Compare 5962-3830202BDX with alternatives