5962R9652601VCC
vs
5962-3830202BDX
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
MOTOROLA INC
|
Part Package Code |
DIP
|
DFP
|
Package Description |
DIP,
|
DFP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AC
|
LS
|
JESD-30 Code |
R-CDIP-T14
|
R-GDFP-F14
|
JESD-609 Code |
e4
|
|
Length |
19.43 mm
|
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Number of Functions |
2
|
4
|
Number of Inputs |
4
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
FLATPACK
|
Propagation Delay (tpd) |
15 ns
|
30 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535 Class V
|
|
Seated Height-Max |
5.08 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
GOLD
|
|
Terminal Form |
THROUGH-HOLE
|
FLAT
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Total Dose |
100k Rad(Si) V
|
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 5962R9652601VCC with alternatives
Compare 5962-3830202BDX with alternatives