5962R9578401VEX vs 54HSC74NB feature comparison

5962R9578401VEX Intersil Corporation

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54HSC74NB Dynex Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTERSIL CORP GEC PLESSEY SEMICONDUCTORS
Part Package Code DIP DIE
Package Description DIP, DIE,
Pin Count 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HSC
JESD-30 Code R-CDIP-T16 X-XUUC-N
Length 19.05 mm
Logic IC Type J-KBAR FLIP-FLOP D FLIP-FLOP
Number of Bits 2 1
Number of Functions 2 2
Number of Terminals 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Propagation Delay (tpd) 35 ns 25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Total Dose 100k Rad(Si) V
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm
Base Number Matches 1 1
Additional Feature RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHNOLOGY

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