5962R8769901BCX
vs
5962-8769901BCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ACT
ACT
JESD-30 Code
R-GDIP-T14
R-GDIP-T14
Length
19.43 mm
19.43 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
8 ns
8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
100k Rad(Si) V
Width
7.62 mm
7.62 mm
Base Number Matches
1
4
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
DIP14,.3
Prop. Delay@Nom-Sup
9.5 ns
Schmitt Trigger
NO
Screening Level
MIL-PRF-38535 Class B
Terminal Finish
TIN LEAD
Compare 5962R8769901BCX with alternatives
Compare 5962-8769901BCA with alternatives