5962R0822801VYC
vs
5962F0822801QYC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code
BGA
Package Description
LGA,
LGA, LGA484,22X22,50
Pin Count
484
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
Bit Size
32
32
Boundary Scan
YES
Clock Frequency-Max
66 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-CBGA-N484
S-CBGA-N484
JESD-609 Code
e4
Length
28.96 mm
Low Power Mode
YES
Number of Terminals
484
484
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
LGA
LGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
38535Q/M;38534H;883B
Seated Height-Max
3.2 mm
Speed
66 MHz
66 MHz
Supply Voltage-Max
2.7 V
Supply Voltage-Min
2.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
GOLD OVER NICKEL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Total Dose
100k Rad(Si) V
300k Rad(Si) V
Width
28.96 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
3
2
Package Equivalence Code
LGA484,22X22,50
Supply Current-Max
1782 mA
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