5962R0324601VXC
vs
5962-0324601Q9X
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Contact Manufacturer
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
E2V TECHNOLOGIES PLC
Package Description
CERAMIC, QFP-256
DIE
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Category CO2 Kg
12.2
12.2
Compliance Temperature Grade
Military: -55C to +125C
Military: -55C to +125C
EFUP
50
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.22
CMRT V6.01
Qualifications
DLA, Rad Hard, Space
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
30.3 MHz
30.3 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CQFP-F256
X-XUUC-N
JESD-609 Code
e4
Length
37.085 mm
Low Power Mode
YES
YES
Number of Terminals
256
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
QFF
DIE
Package Equivalence Code
QFL256,1.5SQ,20
Package Shape
SQUARE
UNSPECIFIED
Package Style
FLATPACK
UNCASED CHIP
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class V
MIL-PRF-38535 Class Q
Seated Height-Max
3.18 mm
Speed
15 MHz
15 MHz
Supply Current-Max
100 mA
Supply Voltage-Max
3.45 V
3.45 V
Supply Voltage-Min
3.15 V
3.15 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Gold (Au)
Terminal Form
FLAT
NO LEAD
Terminal Pitch
0.508 mm
Terminal Position
QUAD
UPPER
Total Dose
100k Rad(Si) V
Width
37.085 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
3
3
Part Package Code
DIE
Candidate List Date
2015-12-17
Compare 5962R0324601VXC with alternatives
Compare 5962-0324601Q9X with alternatives