5962R0151704VXA
vs
5962H0151702VXC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
AEROFLEX COLORADO SPRINGS
|
| Part Package Code |
DFP
|
DFP
|
| Package Description |
DFP,
|
DFP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
3A001.A.1.A
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
90 ns
|
100 ns
|
| JESD-30 Code |
R-PDFP-F28
|
R-CDFP-F28
|
| JESD-609 Code |
e0
|
e4
|
| Memory Density |
4096 bit
|
262144 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
512
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
512X8
|
32KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
MIL-PRF-38535 Class V
|
| Seated Height-Max |
2.921 mm
|
|
| Supply Current-Max |
0.08 mA
|
0.05 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.46 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3.14 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
GOLD
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
100k Rad(Si) V
|
1M Rad(Si) V
|
| Width |
12.446 mm
|
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare 5962R0151704VXA with alternatives
Compare 5962H0151702VXC with alternatives