5962H9659101VRA
vs
5962-8763101RA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
AEROFLEX MICROELECTRONIC SOLUTIONS
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP, DIP20,.3
CERAMIC, DIP-20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
JESD-30 Code
R-XDIP-T20
R-GDIP-T20
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
BUS DRIVER
Max Frequency@Nom-Sup
71000000 Hz
68000000 Hz
Max I(ol)
0.008 A
0.024 A
Number of Functions
8
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535V;38534K;883S
MIL-STD-883
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
4
6
Family
ACT
JESD-609 Code
e0
Length
24.51 mm
Number of Bits
8
Number of Ports
2
Output Polarity
TRUE
Propagation Delay (tpd)
12 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Width
7.62 mm
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