5962H9659001QXC
vs
5962H9659001VXC
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
AEROFLEX MICROELECTRONIC SOLUTIONS
|
AEROFLEX MICROELECTRONIC SOLUTIONS
|
Package Description |
DFP, FL20,.3
|
DFP, FL20,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XDFP-F20
|
R-XDFP-F20
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
71000000 Hz
|
71000000 Hz
|
Max I(ol) |
0.008 A
|
0.008 A
|
Number of Functions |
8
|
8
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC
|
CERAMIC
|
Package Code |
DFP
|
DFP
|
Package Equivalence Code |
FL20,.3
|
FL20,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
38535V;38534K;883S
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Total Dose |
1M Rad(Si) V
|
1M Rad(Si) V
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Base Number Matches |
4
|
4
|
|
|
|