5962H9659001QXC
vs
5962H9659001VXC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
AEROFLEX MICROELECTRONIC SOLUTIONS
AEROFLEX MICROELECTRONIC SOLUTIONS
Package Description
DFP, FL20,.3
DFP, FL20,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDFP-F20
R-XDFP-F20
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
71000000 Hz
71000000 Hz
Max I(ol)
0.008 A
0.008 A
Number of Functions
8
8
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC
Package Code
DFP
DFP
Package Equivalence Code
FL20,.3
FL20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
38535V;38534K;883S
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
1M Rad(Si) V
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
4
4