5962H9658301QCA
vs
5962H9653701VXC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
AEROFLEX MICROELECTRONIC SOLUTIONS
Part Package Code
DIP
Package Description
DIP,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ODD/EVEN PARITY GENERATOR
Family
ACT
JESD-30 Code
R-CDIP-T14
R-XDFP-F16
JESD-609 Code
e0
Length
19.43 mm
Logic IC Type
PARITY GENERATOR/CHECKER
MAGNITUDE COMPARATOR
Number of Bits
9
Number of Functions
1
Number of Terminals
14
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Propagation Delay (tpd)
22 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
38535V;38534K;883S
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
1M Rad(Si) V
Width
7.62 mm
Base Number Matches
4
4
Package Equivalence Code
FL16,.3
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