5962H9657901QXC
vs
5962R8973501SA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
AEROFLEX COLORADO SPRINGS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DFP
Package Description
DFP,
DFP, FL20,.3
Pin Count
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
ACT
ACT
JESD-30 Code
R-CDFP-F20
R-GDFP-F20
JESD-609 Code
e4
e0
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Equivalence Code
FL20,.3
FL20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Propagation Delay (tpd)
19 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class Q
38535Q/M;38534H;883B
Seated Height-Max
2.921 mm
2.286 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
GOLD
Tin/Lead (Sn/Pb) - hot dipped
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Total Dose
1M Rad(Si) V
100k Rad(Si) V
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
6.9215 mm
6.731 mm
fmax-Min
63 MHz
Base Number Matches
4
1
Rohs Code
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Prop. Delay@Nom-Sup
10 ns
Compare 5962H9657901QXC with alternatives
Compare 5962R8973501SA with alternatives