5962H9656801QRX vs HD74LV373T feature comparison

5962H9656801QRX Cobham Semiconductor Solutions

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HD74LV373T Hitachi Ltd

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer AEROFLEX COLORADO SPRINGS HITACHI LTD
Part Package Code DIP TSSOP
Package Description DIP, TSSOP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AC LV/LV-A/LVX/H
JESD-30 Code R-CDIP-T20 R-PDSO-G20
JESD-609 Code e0/e4
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 4 8
Number of Functions 2 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 13 ns 22 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD/GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Total Dose 1M Rad(Si) V
Width 7.62 mm 4.4 mm
Base Number Matches 1 1
Length 6.5 mm
Load Capacitance (CL) 50 pF

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Compare HD74LV373T with alternatives