5962H9655302VXC
vs
5962-89689012X
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
QP SEMICONDUCTOR INC
|
| Part Package Code |
DFP
|
QLCC
|
| Package Description |
DFP,
|
QCCN,
|
| Pin Count |
16
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ACT
|
ACT
|
| JESD-30 Code |
R-CDFP-F16
|
S-CQCC-N20
|
| JESD-609 Code |
e4
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Propagation Delay (tpd) |
20 ns
|
9.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-PRF-38535 Class V
|
MIL-STD-883
|
| Seated Height-Max |
2.921 mm
|
1.905 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
|
| Terminal Form |
FLAT
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Total Dose |
1M Rad(Si) V
|
|
| Base Number Matches |
1
|
1
|
| Length |
|
8.89 mm
|
| Output Characteristics |
|
3-STATE
|
| Width |
|
8.89 mm
|
|
|
|
Compare 5962H9655302VXC with alternatives
Compare 5962-89689012X with alternatives