5962H9654601VXC
vs
5962R9667301VXC
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AEROFLEX COLORADO SPRINGS
|
INTERSIL CORP
|
| Part Package Code |
DFP
|
DFP
|
| Package Description |
DFP,
|
DFP, FL16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
AC
|
4000/14000/40000
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-CDFP-F16
|
R-CDFP-F16
|
| JESD-609 Code |
e4
|
e4
|
| Logic IC Type |
OTHER DECODER/DRIVER
|
OTHER DECODER/DRIVER
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL16,.3
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Propagation Delay (tpd) |
15 ns
|
594 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.921 mm
|
2.92 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
GOLD
|
GOLD
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
1M Rad(Si) V
|
100k Rad(Si) V
|
| Width |
6.731 mm
|
6.73 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.00064 A
|
| Power Supply Current-Max (ICC) |
|
1 mA
|
| Prop. Delay@Nom-Sup |
|
594 ns
|
| Screening Level |
|
MIL-PRF-38535 Class V
|
|
|
|
Compare 5962H9654601VXC with alternatives
Compare 5962R9667301VXC with alternatives