5962H15174QXA vs 5962R0151703VXX feature comparison

5962H15174QXA Cobham Semiconductor Solutions

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5962R0151703VXX Cobham Semiconductor Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AEROFLEX COLORADO SPRINGS AEROFLEX COLORADO SPRINGS
Part Package Code DFP DFP
Package Description DFP, DFP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.1.A EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 110 ns
JESD-30 Code R-PDFP-F28 R-XDFP-F28
JESD-609 Code e0 e0/e4
Memory Density 1048576 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 128000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Organization 128KX8 2KX8
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DFP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q MIL-PRF-38535 Class V
Seated Height-Max 2.921 mm 2.921 mm
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD TIN LEAD/GOLD
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Total Dose 1M Rad(Si) V 100k Rad(Si) V
Width 12.446 mm 12.446 mm
Base Number Matches 1 2

Compare 5962H15174QXA with alternatives

Compare 5962R0151703VXX with alternatives