5962G9655303VXA
vs
5962G9655303VXX
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
AEROFLEX MICROELECTRONIC SOLUTIONS
|
AEROFLEX COLORADO SPRINGS
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XDFP-F16
|
R-CDFP-F16
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.006 A
|
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Prop. Delay@Nom-Sup |
20 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535V;38534K;883S
|
MIL-PRF-38535 Class V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Total Dose |
500k Rad(Si) V
|
500k Rad(Si) V
|
| Base Number Matches |
3
|
2
|
| Part Package Code |
|
DFP
|
| Package Description |
|
DFP,
|
| Pin Count |
|
16
|
| Family |
|
ACT
|
| Number of Outputs |
|
1
|
| Output Polarity |
|
TRUE
|
| Propagation Delay (tpd) |
|
20 ns
|
| Seated Height-Max |
|
2.921 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
|
|
|
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