5962G15175VXC vs UT28F256LVQLC-65UPX feature comparison

5962G15175VXC Cobham Semiconductor Solutions

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UT28F256LVQLC-65UPX Cobham Semiconductor Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AEROFLEX COLORADO SPRINGS AEROFLEX COLORADO SPRINGS
Part Package Code DFP DFP
Package Description DFP, DFP,
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.1.A EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 90 ns 100 ns
JESD-30 Code R-PDFP-F28 R-XDFP-F28
Memory Density 4194304 bit 2097152 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 512000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 512KX8 256KX8
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DFP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class V
Seated Height-Max 2.921 mm 2.921 mm
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Total Dose 500k Rad(Si) V
Width 12.446 mm 12.446 mm
Base Number Matches 1 3
JESD-609 Code e0/e4
Terminal Finish TIN LEAD/GOLD

Compare 5962G15175VXC with alternatives

Compare UT28F256LVQLC-65UPX with alternatives