5962F9655302QXA
vs
SN74LS605NS
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
COBHAM PLC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Package Description |
DFP,
|
DIP, DIP28,.6
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Family |
ACT
|
|
JESD-30 Code |
R-CDFP-F16
|
R-PDIP-T28
|
JESD-609 Code |
e0
|
e0
|
Logic IC Type |
MULTIPLEXER
|
D FLIP-FLOP
|
Number of Functions |
4
|
8
|
Number of Inputs |
2
|
|
Number of Outputs |
1
|
|
Number of Terminals |
16
|
28
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Polarity |
TRUE
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DFP
|
DIP
|
Package Equivalence Code |
FL16,.3
|
DIP28,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Propagation Delay (tpd) |
20 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535 Class Q
|
|
Seated Height-Max |
2.921 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
FLAT
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Total Dose |
300k Rad(Si) V
|
|
Base Number Matches |
2
|
3
|
Rohs Code |
|
No
|
Output Characteristics |
|
3-STATE
|
Trigger Type |
|
POSITIVE EDGE
|
|
|
|
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