Findchips: Compare 5962F9565302VCX vs 5962R9652601QCC

5962F9565302VCX vs 5962R9652601QCC feature comparison

Buy Now

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTERSIL CORP	AEROFLEX COLORADO SPRINGS
Part Package Code	DIP	DIP
Package Description	DIP,	DIP,
Pin Count	14	14
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Family	AC	AC
JESD-30 Code	R-CDIP-T14	R-CDIP-T14
Logic IC Type	NAND GATE	NAND GATE
Number of Functions	2	2
Number of Inputs	4	4
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Propagation Delay (tpd)	15 ns	15 ns
Qualification Status	Not Qualified	Not Qualified
Screening Level	MIL-PRF-38535 Class V	MIL-PRF-38535 Class Q
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Position	DUAL	DUAL
Total Dose	300k Rad(Si) V	100k Rad(Si) V
Base Number Matches	2	1
JESD-609 Code		e4
Length		19.43 mm
Seated Height-Max		5.08 mm
Terminal Finish		GOLD
Terminal Pitch		2.54 mm
Width		7.62 mm
	Logic » Gates	Logic » Gates