5962F8852003CX
vs
HD74HC74FP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
RENESAS ELECTRONICS CORP
Part Package Code
DIP
SOIC
Package Description
DIP,
SOP, SOP14,.3
Pin Count
14
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
HC/UH
JESD-30 Code
R-GDIP-T14
R-PDSO-G14
JESD-609 Code
e0
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
17.5 ns
200 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3 V
4.5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
140 MHz
Base Number Matches
1
2
Pbfree Code
Rohs Code
Length
10.06 mm
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP14,.3
Peak Reflow Temperature (Cel)
260
Seated Height-Max
2.2 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
20
Width
5.5 mm
Compare 5962F8852003CX with alternatives
Compare HD74HC74FP with alternatives