5962F8852003CA vs 74AC74B feature comparison

5962F8852003CA STMicroelectronics

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74AC74B Rochester Electronics LLC

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Part Life Cycle Code Active Active
Ihs Manufacturer STMICROELECTRONICS ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description DIP, DIP14,.3 PLASTIC, DIP-14
Pin Count 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AC AC
JESD-30 Code R-GDIP-T14 R-PDIP-T14
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max I(ol) 0.012 A
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 17.5 ns
Propagation Delay (tpd) 17.5 ns 17.5 ns
Qualification Status Qualified
Screening Level MIL-PRF-38535
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Total Dose 300k Rad(Si) V
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 140 MHz 130 MHz
Base Number Matches 1 2
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.1 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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